Generic hybrid FPA with indium bump bonds [7].

Fabrication of indium bumps for hybrid infrared focal plane array

Christina L. Howe's research works Vanderbilt University, TN (Vander Bilt) and other places

PDF) Quantum Dot Based Infrared Focal Plane Arrays

Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places

A monolithically integrated plasmonic infrared quantum dot camera

MRED simulations comparing reaction mechanisms with experimental

MRED simulations comparing reaction mechanisms with experimental

Generic hybrid FPA with indium bump bonds [7].

Brian SIERAWSKI, Research Associate Professor, PhD Electrical Engineering, Vanderbilt University, TN, Vander Bilt, Institute for Space and Defence Electronics

Emerging fine-pitch bump bonding techniques - ppt video online