UBM (Under Bump Metallization)

Under-Bump Metallization, Advafab

Figure 1 from Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition - ScienceDirect

PDF) Investigation of flip chip under bump metallization systems of Cu pads

15544557.ppt

15544557.ppt

UBM 패드에 솔더 컨택 및 솔더 접합을 생성하는 방법

Under-Bump Metallisation

Tech Brief: Primer on Packaging