a) Under-bump metallization and micro-bumps fabricated on the VLSI

Stevan DJORDJEVIC, Principal Silicon Photonic Engineer

Jon Lexau's research works Oracle Corporation, Redwood City and

Electro- and thermomigration in micro bump interconnects for 3D

Roshanak SHAFIIHA, Staff Engineer, PhD, R&D

Metals, Free Full-Text

Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points

PDF) Microring-based multi-chip WDM photonic module

Multiple System and Heterogeneous Integration with TSV-Interposers

Carbon Nanotubes as Microbumps for 3D Integration

PDF) Microring-based multi-chip WDM photonic module

PPT - Flip Chip And Underfills PowerPoint Presentation, free

Figure 4 from Stacked solder bumping technology for improved