A study of thermal cycling and radiation effects on indium and

The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere [1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless solder bump-bonded dummy detectors through a thermal cycle and then a dose of radiation to observe the effects of cooling, heating and radiation on bump-bonds. We also exercised the processes of HDI mounting and wire bonding to some of the dummy detectors to see the effect of these processes on bump bonds.

Variations of interfacial thermal conductance at melting and

Radiation

A study of thermal cycling and radiation effects on indium and

Frontiers Facile synthesis of lithium argyrodite Li5.5PS4.5Br1.5

PDF) Study of temperature dependence of bump bonding for the BTeV pixel detector

Use of CCD for reflow process design

Periodic Table of Elements Chart – Foxx Life Sciences

Fermin REYGADAS, Executive Director, PhD

Thermoregulation, Part II: Training in the Cold • truPhys

PDF) Design of an UHF RFID Antenna on Flexible Substrate Magnetically Coupled to the Tag

Coatings, Free Full-Text

Photovoltaic windows cut energy use and CO2 emissions by 40% in